HDI PCB Manufacturing — High-Density Interconnect PCB Fabrication
Advanced HDI PCB manufacturing with microvias, fine-line routing, laser drilling and multilayer stack-ups for compact, high-performance electronic designs.
Modern electronics require increased functionality in smaller footprints. HDI (High-Density Interconnect) PCBs enable tighter routing, higher wiring density, improved signal integrity and reduced form factor for smartphones, tablets, automotive systems, industrial controls, IoT and advanced computing.
LinkPCBA provides production-grade HDI PCB solutions with microvia laser drilling, stacked/staggered structures, resin-filled via-in-pad, and controlled impedance across multilayer builds.
Customer Challenge — Miniaturization & Signal Integrity
A global OEM required a compact multi-layer HDI PCB for an industrial IoT controller. The challenges included:
- Fitting high component density within a restricted space
- Achieving 3.5 mil routing for BGA and CSP packages
- Maintaining stable impedance despite tight spacing
- Ensuring microvia reliability during thermal cycling
- Guaranteeing flat, resin-filled via-in-pad for stable SMT soldering
- Controlling layer-to-layer registration for stacked microvias
These requirements exceed the capability of traditional multilayer PCB processes.
A precise HDI-oriented manufacturing approach was essential.
Engineering Solutions — Achieving Density, Reliability & Consistency Microvia Laser Drilling
To solve the customer’s RF challenges, LinkPCBA implemented a complete high-frequency manufacturing workflow:
Microvia Laser Drilling
- CO₂ / UV laser microvias: 0.075 mm – 0.10 mm
- High registration accuracy for stacked microvia structures
- Controlled laser drilling to maintain ideal capture pads
Stacking Configurations
- 1+N+1, 2+N+2, 3+N+3 HDI build-ups
- Stacked, staggered & skip-via structures
- Enhanced dielectric bonding for reliability
Via-In-Pad & Resin Filling
- Full resin-filled via-in-pad for stable BGA/CSP mounting
- Copper cap plating for flat SMT pads
- Defect-free cavity plating for micro BGAs
Fine-Line Routing
- 3 mil / 3 mil fine-line capability
- HVLP copper for improved line definition
- LDI imaging for high accuracy
Impedance & Signal Integrity
- ±5% controlled impedance
- Optimized layer arrangement for high-speed differential pairs
- Simulation-driven stack-up recommendations
Thermal & Mechanical Reliability
- 6× IPC thermal stress
- Cross-section analysis for microvia quality
- AOI + X-ray for complete quality assurance
Summary:These engineering steps enable high wiring density, stable reliability and consistent microvia performance across mass-production.
Performance Validation — Proven HDI PCB Results
The validated production results showed:
- Microvia Reliability: Passed 6× thermal stress cycles
- Flatness: Resin-filled via-in-pad surface planarity < 15 μm
- Trace Accuracy: < 10% width variation after etching
- Dimensional Stability: ±0.05 mm across the panel
- Impedance Variation: ±5% (TDR verified)
- Layer Alignment: ±25 μm microvia registration
These results confirm the HDI PCB structure is fully suitable for high-density, high-speed and compact device applications.
PCB Manufacturing Capabilities
- 1
- 2
- 3
Applications of HDI PCBs
Smartphones & Tablets — microvia + fine-line routing for compact layouts
Wearable Electronics — ultra-small footprint & flexible integration
Automotive Electronics — compact ECUs, ADAS and infotainment systems
Industrial IoT Controllers — dense multilayer architecture
Medical Devices — miniaturized modules requiring reliability
High-Speed Computing — controlled impedance & low-loss routing
Why OEM & ODM Clients Choose LinkPCBA for HDI Manufacturing
- Dedicated HDI PCB manufacturing center specializing in microvias, fine-line routing and complex stack-ups
- Advanced fabrication capability: LDI, vacuum lamination, laser drilling, controlled impedance, back-drill
- High-reliability process control: AOI, X-ray, flying-probe, cross-section analysis
- Engineering-driven support: stack-up design, material selection, impedance tuning and DFM optimization
- Certified production quality: ISO 9001, ISO 14001, IATF 16949, IPC-A-600/6012 Class 2/3
- 24h rapid DFM + quotation for OEM/ODM HDI PCB projects
- Stable, repeatable mass-production performance across every lot
FAQ — HDI PCB
1+N+1, 2+N+2, 3+N+3 with stacked, staggered and skip-via options.
Laser-drilled microvias as small as 0.075–0.10 mm with high registration accuracy.
Yes. We provide resin-filled via-in-pad with copper cap plating for flat SMT pads.
3/3 mil fine-line routing using LDI and HVLP copper.
± 5% controlled impedance verified with TDR for every lot.
Yes. Stacked, staggered and hybrid HDI structures are fully supported.
Prototypes: 4–7 days
Mass production: 10–14 days
Yes. We support high-speed, differential pair and hybrid material stack-ups.
Start Your HDI PCB Project
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⭐ Verified by LinkPCBA Engineering Department — Updated April 2025