Precision PCB Fabrication with Verified Manufacturing Capability

LinkPCBA provides professional PCB manufacturing services focused on precision fabrication, stable process control, and long-term production reliability.

Rather than presenting theoretical limits, our PCB manufacturing capability is defined by qualified production parameters and validated engineering processes, ensuring designs can transition smoothly from prototype builds to stable mass production.

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PCB Manufacturing Technical Capability Overview

Category
Specification
Capability / Range
Layer & Size
Layer Count
1–30 layers (Prototype) / 1–20 layers (Mass Production)
Layer & Size
Max Board Size
570 × 850 mm
Layer & Size
Board Thickness
0.13 – 7.0 mm
Layer & Size
Aspect Ratio
Up to 12:1
Copper & Stack-Up
Copper Weight
Inner: 1/3–6 oz / Outer: 1/2–6 oz
Copper & Stack-Up
Hybrid Stack-Up
FR-4 + RF / FR-4 + Metal Core
Line & Space
Min Line / Space
Down to 3 / 3 mil (by copper class)
Drilling & Vias
Mechanical Hole
0.1 – 6.2 mm
Drilling & Vias
Laser Via
≥0.1 mm (Depth ≤65 μm)
Drilling & Vias
Blind / Buried Vias
Supported
Impedance Control
Impedance Tolerance
±5 Ω (<50 Ω) / ±10% (≥50 Ω)
Materials
Standard & High-TG FR-4
Shengyi, KB, ITEQ, FR408, IT180A
Materials
High-Frequency / RF
Rogers, Taconic
Materials
Metal Core
Aluminum / Copper
Surface Finish
Available Finishes
HASL (LF), ENIG, ENEPIG, OSP, Imm. Silver/Tin
Plating Control
Gold Thickness
0.03 – 0.1 μm
Solder Mask
Mask Colors
Green, Matte Black, Blue, Red, White
Solder Mask
Min Mask Bridge
4 mil
Accuracy
Hole Position Tolerance
±0.076 mm
Accuracy
Board Outline Tolerance
±0.1 mm
Testing
Electrical Test
100% E-Test (Flying Probe / Fixture)
Compliance
Standards
IPC-A-600 / IPC-6012, RoHS, REACH
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All specifications listed in the table represent production-proven capabilities, released through internal engineering validation and quality control procedures.
Capability availability may vary depending on material system, copper weight, and stack-up complexity.

What PCB Manufacturing Means at LinkPCBA

At LinkPCBA, PCB manufacturing is approached as a manufacturing discipline, not a specification showcase.

Our focus is on:

  • Manufacturability at scale
  • Process repeatability across batches
  • Dimensional and electrical consistency
  • Long-term supply stability

Every PCB design is reviewed from a manufacturing-first perspective, reducing yield risk and unexpected variation during volume production.

AI robot with exposed PCB showing internal electronic architecture

Materials, Stack-Up & Process Control

AI industrial control module PCB for stable mass-production

We support a broad range of standard, high-performance, and application-specific PCB materials, including FR-4, high-TG, halogen-free, high-frequency RF, and metal-core substrates.

Material selection and stack-up design are evaluated based on:

  • Electrical performance requirements
  • Thermal and mechanical constraints
  • Reliability expectations
  • Long-term material availability

All fabrication processes are executed under controlled conditions to maintain dimensional accuracy, copper integrity, and impedance consistency.

Quality Assurance & Traceability

Quality control is embedded throughout the PCB manufacturing process, including:

  • Incoming material verification
  • In-process inspection at critical stages
  • 100% electrical testing prior to shipment
  • Batch-level traceability supported by MES systems

Our PCB manufacturing operations comply with applicable IPC standards, as well as RoHS and REACH environmental requirements.

Transparent AI device showing PCB structure, thermal layout, and components

Advanced PCB Manufacturing Support

AI industrial control module PCB for stable mass-production

In addition to standard multilayer boards, LinkPCBA supports advanced PCB manufacturing requirements such as:

  • HDI and blind/buried via structures
  • Impedance-controlled designs
  • Back drilling and via filling
  • High-frequency and mixed-material stack-ups
  • Metal-core PCBs for thermal management

Advanced features are evaluated based on design feasibility and production validation, not theoretical capability claims.

Application Scenarios

AI Intelligence

Security System

Automotive electronics

Industrial control

Medical devices

IoT & smart devices

New energy & power systems

  • AI & Computing Hardware

    High-speed, high-density PCBA for AI accelerators, servers, and edge computing modules. Controlled impedance, multilayer stack-ups, and thermal balance ensure performance and signal integrity under heavy processing loads.

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  • Security & Communication Systems

    Stable and interference-resistant PCBA for surveillance, access control, and communication infrastructure. Designed for 24/7 operation with EMC protection, shielding, and long-term component reliability.

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  • Automotive Electronics

    Precision PCBA manufacturing for automotive control units, ADAS systems, and EV battery management. All assemblies meet IPC Class 3 and IATF16949 standards for vibration resistance and long-term reliability.

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  • Industrial Control Systems

    Durable PCBA solutions for automation, robotics, and power management. High-temperature and high-current designs are validated through AOI, X-Ray, and functional testing to guarantee stability in demanding environments.

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  • Medical Devices

    Certified ISO13485 manufacturing for diagnostic, monitoring, and portable medical electronics. Every production stage follows traceable quality control to ensure safety, accuracy, and compliance with global medical regulations.

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  • IoT & Smart Devices

    Compact, energy-efficient assemblies for IoT modules, wearables, and smart-home systems. RF optimization and multi-protocol compatibility (Wi-Fi, BLE, LoRa) deliver reliable connectivity in small-form designs.

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  • New Energy Systems

    Reliable PCBA manufacturing for renewable energy applications, including solar inverters, energy storage systems, and EV charging infrastructure. Boards are designed for high current, heat resistance, and long operational lifespan under continuous load.

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Why Choose LinkPCBA for PCB Manufacturing

High-frequency RF PCB case study featuring two ENIG-finished multilayer circuit boards designed for 5G and microwave applications.

Customers choose LinkPCBA because we provide:

  • Clearly defined and verified PCB manufacturing capabilities
  • Stable quality performance from prototype to mass production
  • Engineering-driven manufacturing decisions
  • Transparent process control and traceability
  • Long-term production reliability rather than short-term capability claims

We act as a manufacturing partner, not a specification reseller.

FAQ — PCB Manufacturing

1Can these PCB capabilities scale from prototype to mass production?

Yes. All listed capabilities are based on qualified production parameters designed to support both prototype builds and volume manufacturing.

2Do you support custom stack-up and impedance-controlled PCBs?

Yes. Custom stack-up design and impedance control are supported based on material selection and manufacturing feasibility evaluation.

3Are all PCBs electrically tested?

Yes. Every PCB undergoes 100% electrical testing prior to shipment.

4How do you ensure long-term manufacturing consistency?

Consistency is maintained through controlled process windows, material traceability, and ongoing quality monitoring.

5Can you support advanced or high-reliability PCB designs?

Yes. Advanced PCB technologies are supported following engineering review and production validation.

Start Your PCB Manufacturing Project

If you are looking for a PCB manufacturing partner with verified capabilities, controlled processes, and long-term reliability, LinkPCBA is ready to support your project.

Contact us to discuss your PCB manufacturing requirements or request a technical review.

Start Your PCB Manufacturing Project
Download PCB Manufacturing Capability Overview (PDF)

⭐ Updated April 2025 — Reviewed by LinkPCBA Engineering Team