Flexible PCB Manufacturing — High-Reliability Flexible Circuit Fabrication
Reliable single-layer, double-layer and multilayer flexible PCB (FPC) manufacturing using polyimide (PI), rolled annealed (RA) copper and precision laser drilling for compact, bendable and high-reliability electronic designs.
Flexible PCBs enable ultra-thin, lightweight, and bendable circuit structures for wearables, medical devices, consumer electronics, cameras, displays, industrial equipment and compact modules.
LinkPCBA delivers stable and mass-production-ready flexible PCB solutions through audited supply-chain partners combined with LinkPCBA engineering validation and quality inspection.
Customer Challenge — Ultra-Thin, Bendable & Reliable Circuit Structures
A wearable electronics customer required a multi-layer flexible PCB with:
- Ultra-thin structure (<0.15 mm total thickness)
- Continuous bending capability without copper cracking
- Tight dimensional tolerances for small enclosures
- Stable impedance for signal flex regions
- Laser-drilled microvias for compact IC packaging
- Strong coverlay bonding and solderability
Standard FR4 PCBs cannot meet these mechanical and flexibility requirements.
Flexible PCB technology is required.
Engineering Solutions — Thin, Bendable & Stable Flexible Circuits Polyimide-Based Flexible Materials
To solve the customer’s RF challenges, LinkPCBA implemented a complete high-frequency manufacturing workflow:
Polyimide-Based Flexible Materials
- PI (polyimide) base film
- Flex thickness: 12.5–125 μm
- Adhesive and adhesive-free PI options
- RA copper for maximum bending cycles
Flexible Circuit Processing
- Laser drilling: 0.10–0.15 mm microvias
- Coverlay (PI + adhesive) for flex protection
- Stiffeners (PI / FR4 / stainless steel)
- Reinforced copper distribution in bending zones
Fine-Line Routing for Compact Modules
- 4/4 mil standard routing in flex regions
- Selective thick copper where current is required
- Controlled-width traces in fold lines
Flexible-to-Rigid Interface Support
(Used when flex integrates with rigid modules)
- Reinforced pad adhesion
- Optimized stiffeners to support connectors
- Flatness control for SMT mounting
Reliability & Environmental Testing
- Bending cycles: >10,000 times (depending on thickness & RA copper)
- Thermal cycling: −40°C to +125°C
- Humidity & salt-spray testing
- Full visual & AOI inspection of flex circuits
Summary:Engineered for thin, bendable, reliable electronics with stable mechanical performance.
Performance Validation — Proven Flexible PCB Results
After engineering & QA validation, results achieved:
- Bending cycles: >10,000 (typical RA copper flex)
- Dimensional accuracy: ±0.05 mm
- Microvia quality: 0.10–0.15 mm laser via
- Flexibility radius: ≥0.6–1.2 mm depending on copper thickness
- Peel strength: ≥0.8 kgf/cm
- SMT pad flatness: <15 μm
These results confirm flexible PCBs are suitable for high-reliability wearable, medical and consumer device applications.
PCB Manufacturing Capabilities
- 1
- 2
- 3
Applications of Flexible PCBs
Wearables & Fitness Devices
Cameras & Imaging Modules
Medical Portable Devices
Mobile Phones & Tablets
Foldable Consumer Electronics
Automotive Interior Electronics
Industrial Sensors & Compact Modules
Why OEM & ODM Clients Choose LinkPCBA for Flexible PCBs
- Advanced flexible PCB fabrication capability including laser-drilled microvias, polyimide-based structures and precision fine-line processing
- Engineering-driven flex design support, covering bending radius control, stack-up planning and stiffener optimization
- Strict quality assurance workflow with AOI, microvia inspection, dimensional accuracy checks and reliability testing
- High bending-cycle durability, suitable for wearable, medical and compact consumer applications
- Certified quality system ensuring repeatable and stable performance across all production batches
- Fast response engineering with 24h DFM review and quotation for flexible PCB projects
FAQ — Flexible PCB
We support 1–6 layer flexible PCB structures.
Flexible PCB thickness ranges from 12.5–125 μm depending on materials.
Typical bending radius: ≥1.2 mm
Enhanced designs: ≥0.6 mm
Yes. Laser microvias: 0.10–0.15 mm.
Polyimide (PI) base film with rolled annealed (RA) copper.
Yes. PI, FR4 or stainless steel stiffeners are supported for mechanical reinforcement.
Typically >10,000 cycles, depending on thickness and copper type.
Prototype: 5–8 days
Mass production: 10–15 days
Start Your Flexible PCB Project
Get a free flex PCB stack-up review and 24h quotation today.
⭐ Verified by LinkPCBA Engineering Department — Updated April 2025