Our Manufacturing Centers in Shenzhen
LinkPCBA operates three fully-owned manufacturing centers in Shenzhen, providing complete vertical integration from PCB fabrication to SMT assembly and final product box-build.
Our factory network is engineered for high consistency, strong engineering depth, and reliable delivery — the core requirements of global OEM & ODM clients.
With multiple SMT lines, standardized production processes, and complete traceability, we ensure every batch meets strict quality and performance expectations.
PCB Manufacturing Center
Our PCB fabrication center supports advanced, high-reliability circuit manufacturing for both prototypes and mass production.
Core Capabilities
- 1–32 layer multilayer PCB fabrication
- High-frequency PCB (Rogers / PTFE / Hybrid stack-ups)
- HDI capabilities (blind/buried vias, microvias)
- Controlled impedance ±5% tolerance
- Heavy-copper PCBs (up to 12 oz)
- MCPCB / Aluminum PCB / Copper-base boards
- 24–72 hour prototype turnaround
Equipment & Process Strength
- LDI high-resolution imaging for RF and HDI
- Full inner/outer AOI inspection
- Vacuum lamination for stable dielectric performance
- Flying-probe & full electrical testing
- X-ray inspection for via reliability
Quality & Reliability
- IPC Class 2 & Class 3 capable
- Complete material traceability
- Lot-to-lot performance stability
- Optimized stack-up & impedance consulting
Customer Value：Stable RF performance, consistent impedance control, reliable copper bonding, and predictable delivery — ideal for telecom, industrial, medical, and automotive electronics.
PCBA Manufacturing Center (SMT + DIP + Testing)
Our SMT center combines high-speed placement, engineering-driven process control, and rigorous inspection standards, supporting both rapid prototyping and full mass production.
Production Capabilities
- High-speed SMT placement (0201/0402 capable)
- Fine-pitch IC, BGA, QFN, and LGA assembly
- Mixed technology (SMT + through-hole)
- Wave soldering / selective soldering
- Nitrogen reflow available
- Double-sided assembly
Testing & Inspection
Each production batch undergoes multi-stage inspection:
- AOI inspection for every board
- X-ray for BGA/QFN/hidden joints
- ICT electrical testing
- FCT functional test development
- Optional burn-in testing
Engineering Support
Engineering involvement at every step ensures manufacturability and reliability:
- Full DFM + DFA review
- Soldering profile optimization
- PCB/pad design consultation
- Sample validation before mass production
- Failure analysis & root cause correction
- BOM risk assessment & substitution strategy
Customer Value：Higher yields, faster time-to-market, and stable mass production supported by professional engineering teams—not just SMT operators.
Final Assembly Center (Box Build Assembly)
Our final assembly center provides full OEM/ODM product manufacturing, combining PCBA, mechanical assembly, testing, and packaging.
Core Capabilities
- Complete OEM/ODM product assembly
- Mechanical enclosure assembly
- Cable and wiring integration
- Module installation & calibration
- Functional testing for every unit
- Custom packaging & shipment preparation
Customer Value：A true one-stop manufacturing solution — reducing supplier management, lowering cost, and accelerating product launch with consistent quality.
Customer Pain Points → LinkPCBA Solutions
We address the most common challenges global OEM/ODM teams face:
Pain: BOM instability & material inconsistency
Pain: Batch quality inconsistency
Pain: Lack of engineering support
Pain: Unpredictable lead times
Pain: Small batches not supported; large batches unstable
Solution: Long-term supplier system, IQC inspection, and verified substitutes.
Solution: Unified process control across all three factories + full traceability.
Solution: Dedicated engineering team providing DFM, DFX, reviews, and sample validation.
Solution: Parallel production lines, optimized workflow, and controlled scheduling.
Solution: Independent prototype lines + scalable mass-production lines.
What Makes LinkPCBA Different
Real Manufacturing, Not Trading
Three verifiable factories in Shenzhen — no outsourcing or unknown subcontractors.
Engineering-Led Manufacturing
Technical teams lead every project with DFM, analysis, and reliability validation.
Full Vertical Integration
PCB → PCBA → Box Build → Testing → Packaging
All processes managed under one system.
Proven Supply Chain Stability
Long-term supplier partnerships, strict incoming inspection, and component risk control.
Long-Term Partnership Philosophy
We help customers reduce cost, ensure stable production, and grow sustainably over time.
Our Manufacturing Centers (Shenzhen, China)
LinkPCBA operates three vertically integrated manufacturing centers within Shenzhen.
Each focuses on a different stage of electronics manufacturing.
Value to Customers
Stable dielectric performance, controlled impedance, reliable copper bonding, and consistent batch manufacturing.
PCB Manufacturing Center
Our PCB factory provides high-precision fabrication for prototypes and mass production.
Capabilities
- 1–32 layers multilayer PCB
- High-frequency PCB (Rogers, PTFE, Hybrid)
- HDI, impedance control, buried/blind vias
- MCPCB / Aluminum PCB / Copper-base
- Heavy-copper (power board)
- Quick-turn prototype in 24–72 hours
Quality & Equipment
- Automated exposure (LDI)
- AOI inspection
- X-ray, Flying-probe testing
- Vacuum lamination
- IPC Class 2–3 processes
PCBA Manufacturing Center（SMT + DIP + Testing）
Our SMT/PCBA factory delivers consistent assembly quality for small-batch prototyping to high-volume production.
Capabilities
- High-precision SMT for 0201/0402, BGA, QFN
- Mixed assembly (SMT + through-hole)
- DIP wave solder / selective soldering
- Reflow with nitrogen option
- AOI, X-ray, ICT & FCT functional testing
- Complete BOM sourcing & supply chain management
Engineering Support
- DFM & DFA optimization
- PCB/PCBA design review
- Sample validation before MP
- Reliability checks & failure analysis
Value to Customers
Stable yields, fast lead time, and engineering-guided production suitable for automotive, medical, and industrial electronics.
Final Assembly Center（OEM/ODM Box Build）
For customers requiring complete product manufacturing, our assembly center handles:
Capabilities
- Complete product assembly (Box Build)
- Enclosure integration
- Wiring, harnessing, module mounting
- Functional test & burn-in
- Packaging & ready-for-shipment solutions
Value to Customers
A true one-stop manufacturing solution — PCB → PCBA → Assembly → Final product — reducing suppliers, cost, and time-to-market.
Why Global OEM & ODM Clients Choose LinkPCBA
Real Factory, Real Capability
All manufacturing takes place in our three Shenzhen factories, ensuring traceability and genuine production capability.
Engineering-Driven Manufacturing
DFM, design review, stack-up consultation, test planning, and reliability verification — we solve problems before production, not after.
Stable Supply Chain & BOM Support
We maintain long-term partnerships with verified suppliers, ensuring consistent materials and reducing risk.
High Consistency & Quality Assurance
Standardized processes + automated inspection systems = batch-to-batch consistency trusted by global brands.
Long-Term Partnership Mindset
We support customers beyond manufacturing — offering technical advice, production optimization, and market-ready solutions.
Industries We Support
We support customers across multiple high-reliability sectors:
AI Intelligence
Security System
Automotive electronics
Industrial control
Medical devices
IoT & smart devices
New energy & power systems
FAQ — Manufacturing Centers
LinkPCBA operates three in-house factories in Shenzhen, coveringYes. LinkPCBA operates three fully owned and independently controlled factories in Shenzhen, covering PCB fabrication, SMT/DIP assembly, and full product box-build. No production is outsourced to third-party facilities. PCB fabrication, PCBA assembly, and final product box-build.
We are a real manufacturing group, not a trading company.
We support automotive electronics, medicYes. We operate independent prototype lines for fast-turn development and dedicated mass-production lines for stable, scalable manufacturing. This ensures consistent quality and predictable delivery at all production stages.al devices, industrial control, IoT devices, communication equipment, consumer electronics, and new energy products.
Our facilities provide full inspection coverage, including AOI, X-ray, flying-probe, ICT, FCT, solder-joint inspection, via integrity checks, and optional burn-in for high-reliability applications. Every batch is fully traceable.
We use a long-term supplier system, strict IQC incoming inspection, alternative component verification, and BOM risk assessment. Our supply-chain process eliminates common issues such as counterfeit parts, sudden shortages, and inconsistent materials.
We offer vertical integration, engineering-led manufacturing, full in-house processes, and real factory capabilities—not trading or subcontracting. This results in higher consistency, stronger engineering control, and better long-term production stability for OEM/ODM clients.
Contact Our Manufacturing Team
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⭐ Updated April 2025 — Reviewed by LinkPCBA Engineering Team