SMT Assembly Services — High-Precision, Fast Prototyping & Scalable Production
LinkPCBA provides high-precision SMT assembly services supporting fast prototyping, small-batch builds and stable mass production in Shenzhen, China.
Our SMT lines are equipped with Yamaha/ASM high-speed placement machines, 3D SPI, AOI and X-ray inspection, ensuring consistent soldering quality and reliable performance for advanced electronic products.
Why OEM & ODM Clients Choose LinkPCBA for SMT Assembly
Our SMT capability is optimized for complex, high-density and reliability-critical applications.
High-Precision SMT Lines（01005 / 0201 / Fine Pitch）
- Placement accuracy down to 01005 and 0.25 mm pitch, ideal for miniaturized and high-speed circuits.
Stable Production for Prototypes → Small Batch → Mass Production
- Identical process rules, reflow profile, and QC system across all stages.
Engineering-Driven Process（DFM / DFT）
- Full support for stencil design, pad optimization, thermal balance, and reflow simulation.
Full Inspection Chain（SPI → AOI → X-ray）
- Covers solder paste volume, component placement, BGA voids, QFN wetting, and hidden defects.
Shenzhen Supply Chain Advantage
- Access to authorized components, fast replenishment, and flexible material sourcing.
Rapid Prototyping（24–72h）
- Assembly for engineering samples, EVT/DVT builds and pilot runs.
SMT Assembly Capabilities
Component Types
- 01005 / 0201 micro components
- Fine-pitch ICs（0.25 mm）
- BGA / uBGA
- QFN / LGA / CSP
- Shielding cans & RF modules
- Connectors / sockets / odd-shape parts
Machine Capability
- Yamaha / ASM high-speed placement
- Up to 40,000–70,000 CPH
- Multi-zone reflow ovens
- Lead-free RoHS production
Advanced Processes
- Mixed technology（SMT + THT）
- Dual-sided SMT
- Large board support
- RF & high-speed soldering control
- Thermal mass balancing
- Underfill & conformal coating (on request)
Engineering Support — The Heart of Reliable SMT
Our engineering team ensures stable soldering quality before assembly begins.
- Stencil thickness & aperture design
- Pad optimization for QFN / BGA / CSP
- Thermal simulation & reflow curve adjustment
- Component orientation & polarity planning
- Solder mask & copper exposure review
- Panelization with break-off tabs & tooling holes
- Special handling for high-power & RF boards
Engineering involvement is what allows stable yield and predictable performance.
SMT Inspection & Quality Control
Inspection Flow
SPI → Reflow → AOI → X-ray → Visual confirmation → ICT/FCT（if required）
Inspection Capability
- 3D SPI solder paste measurement
- AOI for misalignment, tombstoning, shorts, missing parts
X-ray for:
- BGA voids
- QFN solder coverage
- LGA hidden joints
Quality Standards
- IPC-A-610 Class 2 / Class 3
- RoHS / REACH compliance
- Full traceability with batch tracking
Applications
SMT assemblies at LinkPCBA are widely used in:
Industrial Automation
Automotive Electronics
Medical & Healthcare Devices
Consumer Electronics
IoT & Smart Hardware
New Energy & Power Systems
Case Studies
Case 1 — High-Density Wearable PCB（01005 + BGA）
- Solved QFN voids with optimized stencil design
- Refined reflow curve for temperature-sensitive BLE chip
- Delivered 12+ production batches with stable yield
Case 2 — Automotive Sensor Module
- Dual-sided SMT + selective solder
- Achieved <0.12% defect rate
- Completed environmental stress test (EST) and vibration test
FAQ — SMT Assembly
01005 and 0.25 mm pitch ICs.
Yes, with full inspection and process control.
Yes. 24–72h depending on complexity.
SPI, AOI, X-ray and IPC-A-610 Class 2/3 standards.
Gerber, BOM, Pick-and-Place (CSV/TXT), and assembly drawings.
Start Your SMT Assembly Project Today
Fast Prototyping • High-Precision Assembly • Full Inspection
⭐ Updated April 2025 — Reviewed by LinkPCBA Engineering Team